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- Thermal solution for LED
    High thermal conductive materials for Metal PCB, LED package substrate, LED module

- Semiconductor package substrate
    High thermal conductive materials for SiP (System in Package), MCP (Multi Chip Package)

- Package substrate for RF and high power device
    High thermal conductivity and high dielectric breakdown voltage for the RF application


  Address : 505-12,Mocknae-Dong,Danwon-Gu, Ansan City, Gyeonggi-Do,Korea
TEL : +82-70-7126-3601~3  /  FAX : +82-31-493-3597
E-mail : sales@coresem.com
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