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              특허 및 인증현황 Home > 회사소개 > 특허 및 인증현황           
 

1. 특허 및 인증현황
No
Patent Title
Filing date
1
Test socket and apparatus for testing image sensor package having the same
2007.12
2
Package for device and packaging method thereof
2007.12
3
Method for forming passivation using ink-jet dropping method
2008.03
4
Image sensor package test unit and apparatus for testing image sensor package having the same
2008.01
5
Apparatus for displaying image using persistence of visoin
2008.03
6
Metal substrate and light emitting diode module and method of manufacturing the same
2008.07
7
semiconductor component and method of manufacturing the same
2008.08
8
Metal substrate for electronic component module and method of manufacturing the same
2009.02
9
Insulated metal components and method of manufacturing the same
2009.02
10
Metal substrate for electronic component module and method of manufacturing the same
2009.02


 
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